Flex Division Quick Reference Capabilities |
Layer Construction: |
Trace/Space: |
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Single-Sided
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DoubleSided
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Multilayer
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Flex Rigid
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Dual Access
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Unsupported Leads
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- On ½ oz. Copper Minimum .003/.0035 plus or minus 10%
- On 1 oz. Copper Minimum .006/.006 plus or minus 10%
- On 2 oz. Copper Minimum .012/.012 plus or minus 10%
- Etch capabilities up to 7 oz.
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Tolerances: |
Radius: |
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Routing, plus or minus .002 - .003
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Drilling, plus .000 and minus .0005 Standard bit size
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- Outside minimum sharp 90
- Inside standard .010 (flex mtl)
- Inside absolute minimum .004 (flex laser-fab)
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Plating In-House: |
Outside Services: |
- Electroless Copper
- Electrolytic Copper
- Electrolytic Tin Lead (solder)
- Hard Gold
- Tin Immersion
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- Hot Air Level
- Electrolytic Soft Gold
- Electroless Nickel Immersion Gold
- Entek Organic Coating
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Special: |
Materials: |
- All assembly of stiffeners (Kapton, FR4)
- Creasing
- Folding and PSA's and lamination of three dimensional stiffeners
- Brackets of various materials such as aluminum
- Stainless
- Ceramics and Ultems are all performed at Cordova
- Subassembly of components and connectors are assembled at our outside service
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- Shin-Etsu (UL approved)-Epoxy adhesive system
- Rogers (UL approved)-Epoxy adhesive system
- Dupont FR (UL approved)-FR acrylic adhesive system
- Dupont LF (Not UL approved) LF acrylic adhesive system
- Adhesiveless base materials
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Kapton/Standard Thickness for Base Film, Coverfilm, Stiffeners: |
Product Built to ANSI/IPC Standards: |
- 0.5 mil
- 1.0 mil
- 2.0 mil
- 3.0 mil
- 5.0 mil
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- ANSI/IPC-FC-233A-adhesive coated dielectric films for use as cover sheets for flexible printed wiring.
- ANSI/IPC-FC-233A-Flexible adhesive bonding films.
- ANSI/IPC-FC-241a-Flexible metal clad dielectrics for use in fabrication of flexible printed wiring.
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Turn Around: |
Testing In-House: |
- Specializing in quick turns to accommodate your urgent needs
- Quotes turned around within hours
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- Mania Tester, certification supplied with each lot
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