Rigid PCB's

Layer Count

0-12

Board Material

FR4 Standard (Isola, ITEQ, Nelco) Rogers TMM Laminate Series
FR4 High Temp Taconic (TLY - 5, etc.)
Rogers 3000 Series
Rogers 4000 Series
Rogers RT Duroid Series
Polyimide (Arlon-Med, Nelco)
Halogen Free (Nelco)
Arlon-Med PTFE Laminates


Board Thickness

2-Layer Min .015" Max .200" 2-Layer Min .008" Max .250"
4-Layer Min .020" Max .200" 4-Layer Min .015" Max .250"
6-Layer Min .031" Max .200" 6-Layer Min .025" Max .250"
8-Layer Min .047" Max .200" 8-Layer Min .031" Max .250"
10-Layer Min .062" Max .200" 10-Layer Min .040" Max .250"
12-Layer Min .062" Max .200" 12-Layer Min .047" Max .250"

Max Board Size

6 x 9
6 x 12
9 x 12
12 x 12
12 x 18
18 x 24
Larger – consult fab house

Board Finish Plating

HASL - Leaded Wire Bondable Soft Gold
HASL - Lead Free OSP
Bare Copper White Tin
Nickel Selective Gold
Electrical Nickel Immersion Gold
Electrolytic Soft or Hard Gold
Immersion Silver
Finished CU Weight / Trace/Space


Outer layers

.5 oz. Cu - (Min .003" Trace/Space)
1 oz. Cu - (Min .005" Trace/Space)
2 oz. Cu - (Min .008" Trace/Space)
3 oz. Cu - (Min .012" Trace/Space)
4 oz. Cu - (Min .014" Trace/Space)

Inner layers

.5 oz Cu - (Min .003" Trace/Space)
1 oz. Cu - (Min .005" Trace/Space)
2 oz. Cu - (Min .006" Trace/Space)
3 oz. Cu - (Min .010" Trace/Space)
4 oz. Cu - (Min .012" Trace/Space)

Inner Layer Clearances

.008" .005"

Smallest Finished Hole Size

Final Thickness <=.062" .008" Hole Final Thickness <=.062" .006" Hole
Final Thickness 093" .012" Hole Final Thickness <=.125" .008" Hole
Final Thickness .125" .015" Hole Final Thickness <=.200" .014" Hole

Gold Fingers

1 Edge
2 Edges

LPI Soldermask Colors

Green Top & Bottom Mix
Blue Side to Side Mix
Green Matte
Black
Red
White

Silkscreen Colors

White Top & Bottom Mix
Yellow Red
Black

Quality and Testing

IPC Class 2
IPC Class 3
Netlist Generation
TDR