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Cordova Printed Circuits Inc.,1648 Watson Court, Milpitas, CA 95035
TEL: (408) 942-1100,FAX: (408) 946-3252, EMAIL: cordova1@ix.netcom.com
Manufacturing
Rigid
Layer Construction:
Trace/Space:
  • Single-Sided
  • Double–Sided
  • Multilayer
  • Flex Rigid
  • Dual Access
  • Unsupported Leads
  • On ½ oz. Copper Minimum .003”/.0035” plus or minus 10%
  • On 1 oz. Copper Minimum .006”/.006” plus or minus 10%
  • On 2 oz. Copper Minimum .012”/.012” plus or minus 10%
  • Etch capabilities up to 10 oz.
Tolerances:
Holes Drilled:
  • Routing, plus or minus .002” - .003”
  • Drilling, plus .000” and minus .0005” – Standard bit size
  • .062 thick, minimum drill size .010 plus or minus .003
  • .093 thick, minimum drill size .012 plus or minus .003
  • .125 thick, minimum drill size .018 plus or minus .005
  • Hole to edge, plus or minus .005
Radius:
Plating In-House:
  • Outside minimum sharp 90
  • Inside standard .010”
  • Inside absolute minimum .004”
  • Electroless Copper
  • Electrolytic Copper
  • Electrolytic Tin Lead (solder)
  • Hard Gold
  • Tin Immersion