Flex and Rigid Flex Circuits
Standard Capabilities FPC’s
Layer Count
0-12
Board Material
DuPont FR – FR Acrylic Adhesive System
DuPont LF – LF Acrylic Adhesive System
DuPont APclad
Panasonic – APclad
PSR 9000 Flex Mask
Special Materials – consult fab house
Types of Flex Circuits
Unsupported Leads
Flex Rigid
Dual Access Flex
Multilayer Flex
Max Board Size
6 x 9
6 x 12
9 x 12
12 x 12
12 x 18
18 x 24
Larger – consult fab house
Board Finish Plating
HASL - Leaded Wire Bondable Soft Gold
HASL - Lead Free OSP
Bare Copper White Tin
Nickel Selective Gold
Electrical Nickel Immersion Gold
Electrolytic Soft or Hard Gold
Immersion Silver
Finished CU Weight / Trace/Space
Outer layers
On 1/4 oz. Copper Minimum .003”/.0035” plus or minus 10%
On 1/3 oz. Copper Minimum .003”/.0035” plus or minus 10%
On 1/2oz. Copper Minimum .003”/.0035” plus or minus 10%
On 1 oz. Copper Minimum .006”/.006” plus or minus 10%
On 2 oz. Copper Minimum .012”/.012” plus or minus 10%
Etch capabilities up to 7 oz.
Tolerance
Routing, plus or minus .002” - .003”
Drilling, plus .000” and minus .0005” – Standard bit size
Zif end +/- .003
Trace to edge +/- .005
Inner layers
On 1/4 oz. Copper Minimum .003”/.0035” plus or minus 10%
On 1/3 oz. Copper Minimum .003”/.0035” plus or minus 10%
On 1/2 oz. Copper Minimum .003”/.0035” plus or minus 10%
On 1 oz. Copper Minimum .006”/.006” plus or minus 10%
On 2 oz. Copper Minimum .012”/.012” plus or minus 10%
Etch capabilities up to 7 oz.
Inner Layer Clearances
.008" .005"
Smallest Finished Hole Size
Final .006" Hole
Silkscreen Colors
White Top & Bottom Mix
Yellow Red
Black
Quality and Testing
IPC Class 2
IPC Class 3
Netlist Generation
TDR Testing
UL